JPH0485744U - - Google Patents
Info
- Publication number
- JPH0485744U JPH0485744U JP12876690U JP12876690U JPH0485744U JP H0485744 U JPH0485744 U JP H0485744U JP 12876690 U JP12876690 U JP 12876690U JP 12876690 U JP12876690 U JP 12876690U JP H0485744 U JPH0485744 U JP H0485744U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- molded body
- resin molded
- external leads
- tips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12876690U JPH0485744U (en]) | 1990-11-29 | 1990-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12876690U JPH0485744U (en]) | 1990-11-29 | 1990-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485744U true JPH0485744U (en]) | 1992-07-24 |
Family
ID=31876209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12876690U Pending JPH0485744U (en]) | 1990-11-29 | 1990-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485744U (en]) |
-
1990
- 1990-11-29 JP JP12876690U patent/JPH0485744U/ja active Pending